Roman99
2020-03-10, 02:59 AM
Duixian Liu, Yueping Zhang, "Antenna-in-Package Technology and Applications"
English | 2020 | ISBN: 9781119556633 | 409 pages | PDF | 21.5 MB
Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors - well-known experts on the topic - explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP.
https://www.upload.ee/files/11244582/Antenna-in-Package_Technology_and_Applications.rar.html
English | 2020 | ISBN: 9781119556633 | 409 pages | PDF | 21.5 MB
Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors - well-known experts on the topic - explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP.
https://www.upload.ee/files/11244582/Antenna-in-Package_Technology_and_Applications.rar.html